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3northway lane north latham,new york 12110. tollfree:1.800.984.5337 phone:1.518.956.2980 fax:1.518.785.4725 http://www.marktechopto.com specification part no. : MT4PR100B-UR high power automotive led www.datasheet.co.kr datasheet pdf - http://www..net/
MT4PR100B-UR high power automative led ver.: 01 date : 2007/08/24 page: 1 /6 package dimensions 7.620.5 5.080.3 7.620.5 0.40.2 1.5 2.5 +2 +1 +3 +4 5.080.3 1.550.2 0.5 4.40.2 7.50.2 0.2 3.0 1 4 2 3 notes: 1. all dimensions are in mm. 2. tolerance is 0.25mm unless otherwise noted description led chip part no. material emitting color lens color MT4PR100B-UR algainp/gap hyper red water clear www.datasheet.co.kr datasheet pdf - http://www..net/
MT4PR100B-UR high power automative led ver.: 01 date : 2007/08/24 page: 2 /6 absolute maximum ratings at ta=25
parameter symbol rating unit power dissipation 9 p d 224 mw reverse voltage v r 5 v d.c. forward current if 70 ma peak current(1/10duty cycle,0.1ms pulse width.) if(peak) 100 ma operating temperature range topr. -40 to +100
storage temperature range tstg. -40 to +100
soldering temperature (1.6mm from body) tsld. dip soldering: 260
gpstfd hand soldering: 350
gpstfd electrical and optical characteristics: parameter symbol condition min. typ. max. unit luminous intensity i v if=70ma 1400 2480 mcd luminous flux v if=70ma 3000 - 6100 mlm forward voltage vf if=70ma 2.4 - 3.2 v peak wavelength p if=70ma 632 nm dominant wavelength d if=70ma 618 - 630 nm reverse current ir vr=5v 100 a viewing angle 2 1/2 if=70ma 100 deg spectrum line halfwidth ? if=70ma 20 nm notes: 1.the datas tested by is tester. 2. customer?s special requirements are also welcome.. www.datasheet.co.kr datasheet pdf - http://www..net/
MT4PR100B-UR high power automative led ver.: 01 date : 2007/08/24 page: 3 /6 typical electrical/optical characteristic curves (25
ambient temperature unless otherwise noted) applied voltage (v) forward current if(ma) 20 40 80 60 100 2.02.42.83.23.64.0 70.0 forward current (ma) relative luminous intensity(mcd) 35.0 0 1000 2000 4000 3000 5000 105 0.0 forward current vs. applied voltage forward current vs. luminous intensity ambient temperature ta ( )
0 204060 100 80 forward current if(ma) 20 40 80 60 100 (tjmax.=110
) r j-a=211
8 r j-pin=140
8 30 40 50 70 60 90 80 0.4 0.6 0.1 0.3 0.8 0.7 0.5 0.9 1.0 0.2 10 0 20 ambient temperature vs. forw ard current radiation diagram www.datasheet.co.kr datasheet pdf - http://www..net/
MT4PR100B-UR high power automative led ver.: 01 date : 2007/08/24 page: 4 /6 sp ecifications for bin grading: v(mlm) bin min. max. j 3000 4200 k 3500 4800 l 4000 6100 specifications for vf group: vf(v) bin min. max. v5 2.4 2.6 v6 2.6 2.8 v7 2.8 3.0 v8 3.0 3.2 www.datasheet.co.kr datasheet pdf - http://www..net/
MT4PR100B-UR high power automative led ver.: 01 date : 2007/08/24 page: 5 /6 precautions: take note of the following in use of led 1. temperature in use since the light generated inside the led needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. consequently, the heat resistant ability of the resin used for led is usually low; therefore, please be careful on the following during use. avoid applying external force, stress, and excessi ve vibration to the resins and terminals at high temperature. the glass transition temperature of epoxy resin used for the led is approximately 120-130
. at a temperature exceeding this limit, the co efficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. if external force or stress is applied at that time, it may cause a wire rupture. 2. soldering please be careful on the following at soldering. after soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temp erature), (1) soldering measurements: distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) dip soldering: pre-heat: 90
max. (backside of pcb), within 60 seconds. solder bath: 260 ? 5
(solder temperature), within 5 seconds. (3) hand soldering : 350
max. (temperature of solderin g iron tip), within 3 seconds 3. insertion pitch of the led leads and pitch of mounting holes need to be same 4. others since the heat resistant ability of the led re sin is low, smd components are used on the same pcb, please mount the led after adhesive baking process for smd components. in case adhesive baking is done after led lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the led and follow the conditions below. baking temperature: 120
max. baking time: within 60 seconds if soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the led to normal temperature. www.datasheet.co.kr datasheet pdf - http://www..net/

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